By Arlington Economic Development Corporation
Salcomp to Establish U.S. Headquarters in Arlington, Creating 660 New Jobs
Established in 1973, Salcomp, a global leader in power supplies for mobile and electronic devices from Finland, is expanding its U.S. operations by establishing its headquarters in Arlington, Texas. The company also manufactures sensors with wireless connectivity technology, precision structural parts and modules, 5G RF components, and magnetic materials.
Headquartered in Salo, Finland, Salcomp operates production plants in China, Brazil, and India, a manufacturing facility in Arlington, and maintains offices in the U.S., Brazil, Taiwan, South Korea, and Hong Kong, employing over 12,000 people worldwide.
The new U.S. headquarters in Arlington will create 660 new positions, including 156 roles with an average salary of $122,000. Salcomp plans to hire local residents and graduates from UT Arlington over the next three to five years. This marks the second major corporate relocation from Silicon Valley to Arlington in the past year.
Salcomp will enter a performance agreement with the Arlington Economic Development Corporation (EDC) to help offset project costs. “The best economic development always begins with existing business retention and expansion. Taking care of who’s here now,” said Marty Wieder, executive director of Arlington EDC.
“This agreement supports Salcomp’s product line growth and expanded hiring while prioritizing jobs for Arlington residents and UTA graduates—a real ‘win to the nth power’ for Arlington,” Wieder added.
To meet growing demand, Salcomp will expand operations at its current Arlington facility and retrofit it with three new production lines. The Arlington EDC will provide payments not to exceed $1,876,622, including 30% for infrastructure and site improvements, support for establishing the U.S. headquarters, and a hiring grant of up to $2,500 per local resident or UTA graduate. Grant payments will be issued only if Salcomp meets all criteria of the performance agreement.